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Lapping Polishing Unit
Solicitation Number: HSSS01-12-Q-0108
Agency: Department of Homeland Security
Office: United States Secret Service (USSS)
Location: Procurement Division
Notice Type: ARCHIVE
SynopsisThis is a combined solicitation/synopsis for a lapping polishing unit meeting the following specifications:
Lapping Polishing equipment requirements:
•a. Must be suitable for parallel polishing (de-processing) integrated circuit die for the purposes of imaging the process layers.
•b. Must include all required equipment such as a polishing fluid pump, etc.
•c. Must include any equipment required for aligning the die to the polishing surface for precise parallel polishing. A dial indicator or other mechanical measuring equipment which can be used to check alignment is acceptable for this requirement so long as there are established procedures for this operation. Higher precision optical alignment is preferred if within budget constraints.
•d. Must include a starting set of any required consumables and accessories to enable testing and using the equipment out of the box. (i.e. holders, polishing fluid, polishing pad(s), crystal wax, etc.)
•e. Any additional consumables should be easily purchasable.
•f. Must provide a way to quickly go from polishing to imaging and back to polishing without complicated realignment of the sample.
•g. Polished surface must be smooth enough for imaging die features under a high power optical microscope or SEM.
•h. Stub / de-processing holders should be compatible with FEI Nanolab SEM/FIB sample holder mounts.
•· Detailed accuracy requirements.
•a. micrometer Z direction control accuracy (or better)
•b. Tilt control with a range of around +-2 degrees
•c. Adjustable sample load from 0 to 3kg in 50g (or less) increments.
•d. Typical alignment accuracy of 2 microns or better.
Note: Ultrapol stub/de-processing holder for FEI is order code: 6172.F
Must include shipping to 74104 area code
Award will be made to the lowest priced offeror meeting the above specifications.